(a) (c) (b) (d) 1. part no. expression : (b) category code (a) series code 2. c0nf igurat ion & di me ns ions : 4. mate ri als : superworld electronics (s) pte ltd (a) body : ceramic ( pb free ) (b) termination : ( pb free ) a 3. sche mati c : (c) inductance code : 1n0 = 1.0nh 5. ge ne ral sp ecif ication : c1hq series pg. 1 note : specifications subject to change without notice. please check our website for latest information. 28.01.2015 0.60 0.10 bcd 1.00 0.05 a 0.50 0.05 b ag(100%) ni(100%)-1.5u m(min.) sn(100%)-3.0u m(min.) 0.175 0.075 c 1 h q - 1 n 0 s - a) operating temp. : -40 c to +105 c ( including self-temperature. rise ) ceramic chip inductors (e) c a d b 11 ~ 99 : internal control number (d) inductance tolerence : s= 0.3nh , j= 5% , k= 10% (e) 10: standard recommended pc board pattern h l g b) storage condition (component in its packaging) i) temperature : -10 to 40 c ii) humidity : 60% 0.50~0.55 gh unit:m/m 1.55 ref. l 0.60~0.70
superworld electronics (s) pte ltd c1hq series note : specifications subject to change without notice. please check our website for latest information. pg. 2 28.01.2015 6. electrical characteristics : 100 100 100 100 100 100 100 100 100 100 100 100 test frequency ( mhz ) 100 100 c1hq-1n0s-10 part number typ. 710 dc resistance ( ? ) min q 8 inductance tolerence : s= 0.3nh , j= 5% , k= 10% 1.0 (nh) 1.2 1.5 2.0 1.8 3.0 3.6 3.3 4.3 3.9 2.2 2.4 2.7 4.7 inductance ( mhz ) min. srf rated current (ma) max 5.1 100 0.07 8 8 8 8 8 8 8 8 8 8 8 8 8 8 710 710 710 660 660 630 630 570 540 500 490 470 450 430 10000 >13000 11000 10500 10000 9600 9200 8700 8300 7800 7300 6900 6400 6300 100 100 100 100 100 420 400 390 370 360 6200 6100 6000 5500 5000 8 8 8 8 8 5.6 6.2 6.8 7.5 8.2 c1hq-1n2s-10 c1hq-1n5s-10 c1hq-1n8s-10 c1hq-2n0s-10 c1hq-2n2s-10 c1hq-2n4s-10 c1hq-2n7s-10 c1hq-3n0s-10 c1hq-3n3s-10 c1hq-3n6s-10 c1hq-3n9s-10 c1hq-4n3s-10 c1hq-4n7s-10 c1hq-5n1s-10 c1hq-5n6s-10 c1hq-6n2s-10 c1hq-6n8s-10 c1hq-7n5s-10 c1hq-8n2s-10 q(typ.) frequency(mhz) 300 800 900 1500 1800 53 45 35 32 38 37 34 30 31 32 33 34 29 30 30 30 31 28 28 29 129 97 69 61 68 67 54 49 51 54 53 53 47 48 48 48 49 44 45 46 147 110 76 66 73 71 59 52 54 57 56 56 50 51 51 51 52 49 50 50 217 156 104 92 94 92 74 67 70 72 71 70 64 65 64 65 66 59 60 62 244 177 116 100 103 101 86 73 76 79 77 76 71 72 71 71 72 64 65 66 max. 0.014 typ. >13000 8000 6000 6000 6000 6000 6000 6000 6000 5000 4000 4000 4000 4000 4000 3900 3900 3700 3600 0.07 0.016 0.07 0.030 0.07 0.035 0.08 0.035 0.08 0.040 0.09 0.050 0.09 0.060 0.11 0.070 0.12 0.075 0.14 0.080 0.15 0.085 0.16 0.090 0.17 0.095 0.19 0.110 0.20 0.120 0.22 0.130 0.23 0.130 0.25 0.135 0.27 0.140 100 350 4800 8 9.1 c1hq-9n1s-10 29 45 49 59 62 3400 0.29 0.150 100 330 4500 8 10 C1HQ-10NS-10 28 45 48 57 60 3200 0.31 0.165 100 300 4300 8 12 c1hq-12ns-10 26 40 45 51 52 2700 0.39 0.165 100 280 4100 8 15 c1hq-15ns-10 25 38 42 49 51 2300 0.45 0.190 ceramic chip inductors 10000 >13000
note : specifications subject to change without notice. please check our website for latest information. superworld electronics (s) pte ltd pg. 3 28.01.2015 c1hq series 7. characteristics curves : ceramic chip inductors impedance v.s. frequency characteristics inductance v.s. frequency characteristics q v.s. frequency characteristics 1 10 100 1000 10000 fr e q u e n c y ( m h z ) 0.1 1 10 100 1000 i m p e d a n c e ( ohm ) hci1005hq z vs fr eq . 1.5n 2. 7n 4.7n 8. 2n 15n 1 10 100 1000 10000 f r e q u e n cy ( m h z ) 1 10 100 inductance(nh) hci1005hq l vs fr e q. 1.5 n 2. 7n 4.7 n 8.2 n 15 n 1 10 100 1000 10000 fr e q u e n c y ( m h z ) 1 10 100 q hci1005hq q vs freq. 1.5n 4. 7n 15n
note : specifications subject to change without notice. please check our website for latest information. superworld electronics (s) pte ltd pg. 4 28.01.2015 c1hq series 8. soldering and mounti ng : 8-1. recommended pc board pattern if wave soldering is used ,there will be some risk. 8-2.2 soldering iron (figure 2) : 8-2.1 lead free solder re-flow : note. cannot be avoided, the preferred technique is the utilization of hot air soldering tools. mildly activated rosin fluxes are preferred. the terminations are suitable for re-flow soldering systems. if hand soldering recommended temperature profiles for re-flow soldering in figure 1. products attachment with soldering iron is discouraged due to the inherent process control limitations. in the event that a) preheat circuit and products to 150 c. b) 350 c tip temperature (max) c) never contact the ceramic with the iron tip a soldering iron must be employed the following precautions are recommended. note : 8-2. soldering e) use a 20 watt soldering iron with tip diameter of 1.0mm f) limit soldering time to 4 ~ 5 secs. d) 1.0mm tip diameter (max) under mechanical stress as warping the board. the mechanical stress to prevent failure. products shall be positioned in the sideway direction against pc board should be designed so that products are not sufficient figure 2. hand soldering : 1 times max g rad ual c0oling temperature c over 1min. 350 150 preheating soldering cooling natural w i t h i n 4~ 5s h l g figure 1. re-flow soldering : 3 times max time(sec.) 60~150s 20~40s s olde ring temperature c 4 80s max. 60~180s 150 25 tp(260 c/40s max.) 217 200 preheating cooling natural ceramic chip inductors 0.50~0.55 gh unit:m/m 1.55 l 0.60~0.70 re-flow soldering temperatures below 240 degrees, there will be non-wetting risk
superworld electronics (s) pte ltd note : specifications subject to change without notice. please check our website for latest information. pg. 5 28.01.2015 c1hq series may cause the failure of mechanical or electrical performance. solder shall be used not to be exceed as shown in fig. 3. accordingly increasing the solder volume, the mechanical stress to product is also increased. exceeding solder volume figure 3 r ec 0mmendable upper limit t 8-3. solder volume ceramic chip inductors minimum fillet height = soldering thickness + 25% product height
9. packaging information : superworld electronics (s) pte ltd note : specifications subject to change without notice. please check our website for latest information. pg. 6 28.01.2015 c1hq series 9-1. reel dimension 7" x 8mm 178.0 2.0 b(mm) 50 or more 10 1.5 a(mm) type 13 0.2 c(mm) d(mm) chip size chip / reel inner box middle box carton 9-3. packaging quantity material : paper 9-2 tape dimension / 8mm w:8.0 0.1 ao p p2:2 0.10 e:1.75 0.1 f:3.5 0.1 d:1.56+0.1-0.05 po:4 0.1 size ko bo t c1hq 0.75 0.10 ao(mm) 1.15 0.10 bo(mm) ko(mm) 0.80 max 0.80 max 2.0 0.05 p(mm) t(mm) 50000 250000 500000 c1hq 10000 ceramic chip inductors d embossed carrier b a cover tape 2.0 0.5 ?c
note : specifications subject to change without notice. please check our website for latest information. superworld electronics (s) pte ltd pg. 7 28.01.2015 c1hq series ceramic chip inductors base tape 9-4. tearing off force top cover tape 165 c to 180 c f the force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. teari ng speed room humidity room temp. ( c) 5~35 (%) 45~85 room atm 860~1060 (hpa) 300 (mm/min) a) recommended products should be used within 12 months from the time of delivery. b) the packaging material should be kept where no chlorine or sulfur exists in the air. b) the use of tweezers or vacuum pick up is strongly recommended for individual components. c) bulk handling should ensure that abrasion and mechanical shock are minimized. a) products should be handled with care to avoid damage or contamination from perspiration and skin oils. to maintain the solderabililty of terminal electrodes : 1. storage conditions : application notice 2. transportation :
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